Hi-bond tapes range of thermal management tapes are of the highest quality and performance available.
The three different categories are:
In recent years the electronics industry has become far more sophisticated and with size reduction of devices, the requirement for heat dissipation is becoming increasingly crucial for manufacturers.
Heat management for mobile phones, tablets, computers, television and for all electrical devices generating heat is necessary.
Tapes used as thermal interface materials and bonding medium are ideal for reducing hotspots and protecting sensitive circuitry and components.
Pyro-Bond™ tapes can be die-cut into precise complex shapes for intricate designs and applications, supplied as individual pieces or on rolls and sheets.
hi-bond Thermal Transmission Acrylic foam Tape
Hi-Bond Thermal Transmission grade of acrylic foam tapes have been specially formulated to provide a strong structural bond on different substrates while still allowing for thermal transmission.
These double-sided tapes have excellent heat transmission properties making them ideal for bonding applications in the electronics industry, this unique formulation has all the characteristics of a powerful mounting, bonding and fixing tape, while allowing heat to dissipate.
Acrylic foam tapes are viscoelastic which allows for thermal expansion and contraction without any loss of adhesion.
The tape contains ceramic micro-spheres which is the thermal transmission medium, the micro-spheres also give the tape very good cohesive strength.
Fixing heat-sinks, bonding thermal interface materials, bonding cooling elements, fixing components in the electronic industry, ideal for bonding LED lights and fixing elements of back light displays.
Features and Benefits:
Thermally Conductive Foil Tapes
Pyro-bond™ thermally conductive foil tapes are available in four thicknesses using high grade copper and aluminium foils coated with high performance graphite and nickel conductive adhesives.
Designed to give excellent dissipation in the X-Y plane and high interface performance, minimising heat conduction in the Z axis.
HB 060 TC - is a copper foil tape with a graphite adhesive giving fast heat spread, with a total thickness of 60 micron the tape is ideal for shielding with very good conductivity.
HB 160 TC - is a aluminium foil tape double coated with a graphite adhesive for interface applications giving superior thermal conductivity in the plane quick heat spread and very good adhesion and stability.
HB 150 TC - is a aluminium foil tape laminated on the surface with PET, coated with a graphite adhesive to give very effective diffusion of heat.
HB 050 TC - this is a copper foil tape with a top coating of graphite to give very good heat spread in the X and Y axis, coated with an electrically conductive adhesive to give excellent shielding properties.
Pyro-Bond™ Natural Graphite Tapes
Natural graphite used in thermal management is a soft crystalline material with anisotropic characteristics due to its layered structure. Thermal properties in the XY plane are far greater than in the Z axis, which gives excellent heat spread and conductivity performance and is an ideal material for producing thermal interfaces, thermal conductive values greatly exceed those of copper and aluminium.
Graphite is 25% lighter than aluminium and 75% lighter than copper, which is a benefit for applications with mobile devices such as smart phones and tablets.
The flexibility and conformability of graphite facilitates use as an interface material when used for heat sinks, heat spreaders and TIMs. Natural graphite is formed into thin sheets which can be laminated with adhesives then die-cut in complex shapes for specific applications.
Pyro-bond™ natural graphite is available in thickness range from 30 micron to 940 micron thick. Ideal for a wide range of thermal interface applications.
Properties and features:
Pyro-Bond™ Pyrolytic Synthetic Graphite Tape
Pyro-Bond™ Synthetic graphite is produced by converting film material at extremely high temperature in excess of 3000°C using an annealing process a graphite layered film is formed under pressure which is highly crystalline.
This is a proprietary manufacturing process producing unique synthetic graphite films of the highest quality and performance. The film is multi layered and highly uniform and oriented unlike natural graphite, this gives outstanding thermal properties and characteristics.
The grades of Pyro-bond™ synthetic graphite are available in 17, 25, 40 micron thickness.
Properties and features
Within the electronics market there is a trend towards higher power densities within devices. More power in restricted space generates more heat which needs to be dissipated, to keep components at required low temperatures. Efficient thermal management is crucial in reducing the failure rate of components, for every 10°c increase in temperature there is a doubling of component failure.
Thermal management can be categorised at different levels:
Chip - dissipating heat from the actual chip
Boards - heat transfer from printed circuit board or chip to the electronic system or chassis.
Systems - dissipating heat from the system or chassis to the system heat exchangers.
Common methods is to use copper foils as heat spreaders from the chips. Copper or aluminium foils from the PCB, to realise effective heat transmission it is important to have high thermal conductivity over a large relative area with minimal interface thickness.
Good compression of the interface material is required to have optimum surface contact between the two substrates, this is termed “wet out” which is achieved under pressure. Good wet out prevents air-gaps which act as thermal barrier with very low conductivity, with the air-gaps filled by Pyro-Bond™ tape thermal dissipation is high.
Thermal Interface Properties and Characteristics:
Optimum sustained surface contact is important in TIM when the two different substrates are joined good wet out and minimal air gaps are required, to prevent a thermal barrier or break.
Pyro-bond™ tapes have distinct advantages over other forms of interface materials such as silicones, thermal greases, putties and pastes. Putties, greases and pastes are not precise mediums and the amount and thickness applied are difficult to control, they also are not a fixing and bonding mechanism and have to be used in conjunction with a mechanical fixing which adds to assembly costs. Greases, putties and pastes are messy and difficult to work with and are variable in how they are applied as they flow and ooze.