NEW from Hi-Bond – Thermal Interface Materials

As the need to improve transfer of heat across solid materials increases, Hi-Bond® Thermal Interface Materials have been engineered to deliver exceptional thermal management which prevents overheating, ensuring stable performance and extending device longevity in most application areas.

Hi-Bond® delivers this range of silicone and acrylic foams and solid acrylic materials to provide highly efficient pathways for the dissipation of excess and unwanted thermal issues. Designed to deal with uneven surfaces, air gaps, and rough textures, these products create highly efficient heat dissipation – preventing overheating, ensuring stable performance, and extending device longevity. 

Hi-Bond® can deliver these products in roll, sheet, and die cut shapes to meet individual customer project needs. This gives customer the ability to simplify integration into projects and assembly lines without the need for complex mechanical fasteners.

Applications

• Electronics: ICs, CPUs, MOSFETs, LEDs. 
• Telecom: 5G and networking equipment. 
• Automotive: EV battery cells, modules, and electronics. 
• Industrial Power: Power supplies, motherboards, heat sinks. 
• Energy Storage: Battery energy storage systems

Product Range

HPS XXST Thermal Interface Silicone Foams (0.5 – 8.0mm

• Thermal conductivity 1.5 to 6.5 W/mK 
• Excellent conformability and recovery 
• Outstanding electrical insulation and thermal stability 
• Controlled low molecular siloxane to reduce bleeding.

HB02ST, HB03ST, HB05ST, HB07ST.

HB 3700 Thermal Interface Acrylic Foams (1.0 – 2.0mm)

• Ceramic particle filled acrylic elastomers 
• Low gas emission 
• No siloxane or oil content to eliminate bleeding 
• Outstanding electrical insulation and thermal stability.

HB3710, HB3712, HB3715, HB3720.

VST Foamed Acrylics – White Acrylic Foam Tape.

• The products are designed for bonding applications where thermal management is a requirement.
• Thermal conductivity up to 1.0w/mK.

VST7025W, VST 7064W, VST 7120W

TCW Foamed Acrylics – Thin White Thermally Conductive Acrylic tape.

• For bonding applications where the prime role is control of thermal issues.

TCW 050, TCW 100, TCW 200, TCW 4100.

Pyro-Bond™ Natural Graphite Tapes–

Natural graphite used in thermal management is a soft crystalline material with anisotropic characteristics due to its layered structure. Graphite has:

• Superb thermal and electrical conductive properties.
• Ideal material for producing thermal interfaces. 

PB 030N, PB 050N, PB 070N, PB 100N, PB 200N, PB 450N, PB 940N.

Pyro-Bond™ Pyrolytic Synthetic Graphite Tapes–

The film is multi-layered and highly uniform and oriented unlike natural graphite, this give outstanding thermal properties and characteristics.

• Outstanding thermal properties and characteristics.
• Highly uniform and oriented unlike natural graphite.

 PB 017S, PB 025S, PB 040S.

Fire Retardant Tapes- 

HB Fire Retardant Tape for bonding applications where the bond line must meet UL94 V0.
Excellent adhesion to most material, commonly used in EV battery modules and packs.
Available in a variety of thicknesses.

HB XXXFR Tapes are flame-retardant and meet UL94 V0.

Product VST6064WFR & VST6110WFR are flame-retardant and have been tested and passed Aerospace (FAR/JAR) flammability. Approved to UL94 V0.

HB 030FR, HB 045FR, HB 050FR, HB 100FR, VST6064WFR, VST6110WFR.